diamond Single Side Polishing machine

CYKY diamond Single Side Lapping/Polishing machines SSP-50DPAW feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance

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diamond Single Side Lapping Application:

• Sapphire Substrate / Wafer

• Semiconductor Wafer

• Tungsten Carbide Parts

• Ceramic Parts

• Valves

• Crystal Glass

• Oscillator Parts

technical parameter:

Items			SSP-36DPAW	SSP-50DPAW
Polishing plate	Plate material		Oxygen free Cu , Resin-Cu	Oxygen free Cu
	Plate material		Or Tin plate (*option)	or Tin plate(*option)
	Plate size		Φ910mm	Φ1240mm
	Revolution control		By inverter.	Home position.
	Plate cooling		Cooling water jacket	Cooling water jacket
Pressure plate	P. Plate		4 axles.	4 axles. (driving force system individually)
	P. Plate		4 axles.	4 axles. (driving force system individually)
	Block size		360mmΦ	485mmΦ
	Applied pressure		By cylinder	By cylinder
	Work block		-	Auto Centering
Facing unit			Mounting type.	Square type.
Capacity / batch			4 inch wafer x 24 Pcs	4 inch wafer x 40 Pcs
Capacity / batch			6 inch wafer x 12 Pcs	6 inch wafer x 24 Pcs
Utility		Electricity	AC220V, 3Phase, 60Hz	AC220V, 3Phase, 60Hz
Utility		Pneumatic	0.5~0.8 Mpa	0.5~0.8 Mpa
Etc		Machine Size	1350 2250 1920 mm	1640 3029 2575 mm
		Machine Weight	3,500Kg.	5,500Kg.
		Controller	Touch Screen (Proface)	Touch Screen (Proface)
		Signal lamp with alarm